TRENDS IN ASSEMBLING OF ADVANCED IC PACKAGES

Trends in assembling of advanced IC packages

In the paper, an overview of the current trends in the development of advanced IC packages will be presented.It will color touch 7/97 be shown how switching from peripheral packages (DIP, QFP) to array packages (BGA, CSP) and multichip packages (SiP, MCM) affects the assembly processes of IC and performance of electronic systems.The operation igloo

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