Trends in assembling of advanced IC packages

Trends in assembling of advanced IC packages

Blog Article

In the paper, an overview of the current trends in the development of advanced IC packages will be presented.It will color touch 7/97 be shown how switching from peripheral packages (DIP, QFP) to array packages (BGA, CSP) and multichip packages (SiP, MCM) affects the assembly processes of IC and performance of electronic systems.The operation igloo white progress in bonding technologies for semiconductor packages will be presented too.

The idea of wire bonding, flip chip and TAB assembly will be shown together with the boundaries imposed by materials and technology.The construction of SiP packages will be explained in more detail.The paper addresses also the latest solutions in MCM packages.